Indium Corporation Features InFORMS Reinforced Solder Preforms at NEPCON South China 2017

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS^®, at NEPCON South China 2017, Aug. 29-31 in Shenzhen, China.

Indium Corporation is redefining solder with its InFORMS^® solder preforms. InFORMS^® are a composite preform consisting of solder and a reinforcing matrix. Together, lateral strength is increased and bondline co-planarity is improved. In addition, superior thermal cycling reliability can be achieved.

When InFORMS^® were used to solder a DBC to the baseplate of an IGBT, one study showed:

• 4x improved thermal cycling reliability compared to a solder preform-only approach
• 2x improved thermal cycling reliability compared to a solder preform + Al wirebond stitch approach
• Reduced voiding (<1%)
• Lower cost of ownership – as a drop-in replacement for a standard preform or solder paste, InFORMS^® require no additional process steps or equipment

For more information about InFORMS^®, visit indiumstg.wpenginepowered.com/informs.

인듐 코퍼레이션(Indium Corporation)에 대한 자세한 정보는indiumstg.wpenginepowered.com을방문하거나[email protected]으로 이메일을 보내 주시기 바랍니다. 또한www.facebook.com/indium또는@IndiumCorp에서 당사의 전문가 그룹인 From One Engineer To^Another®(#FOETA)를 팔로우하실 수 있습니다.