Indium Corporation Features InFORMS Reinforced Solder Preforms at NEPCON South China 2017

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS^®, at NEPCON South China 2017, Aug. 29-31 in Shenzhen, China.

Indium Corporation is redefining solder with its InFORMS^® solder preforms. InFORMS^® are a composite preform consisting of solder and a reinforcing matrix. Together, lateral strength is increased and bondline co-planarity is improved. In addition, superior thermal cycling reliability can be achieved.

When InFORMS^® were used to solder a DBC to the baseplate of an IGBT, one study showed:

• 4x improved thermal cycling reliability compared to a solder preform-only approach
• 2x improved thermal cycling reliability compared to a solder preform + Al wirebond stitch approach
• Reduced voiding (<1%)
• Lower cost of ownership – as a drop-in replacement for a standard preform or solder paste, InFORMS^® require no additional process steps or equipment

For more information about InFORMS^®, visit indiumstg.wpenginepowered.com/informs.

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