Indium Corporation will feature its metal thermal interface materials for burn-in, including Heat-Spring® and HSMF-OS, at Burn-in & Test Strategies Workshop on March 4-7 in Mesa, Ariz.
Indium Corporation’s Heat-Spring® is designed for use in the burn-in process. It is patterned to optimize contact with non-planar surfaces with a pressure range of only 35-100+ psi. Heat-Spring® is available in InAg and InSn alloys and pure indium.
HSMF-OS has a multi-layer construction with a total thickness of 0.004” that is designed for multiple insertions. It has an aluminum layer that acts as an interface with the device under test, and has a tensile strength of approximately 90 MPa with a soft, compliant polymer backing, which provides a configuration with “designed-in” insertion survivability.
To learn more about Indium Corporation’s metal thermal interface materials for burn-in and test, visit indiumstg.wpenginepowered.com/bits.
인듐 코퍼레이션(Indium Corporation)에 대한 자세한 정보는indiumstg.wpenginepowered.com을방문하거나[email protected]으로 이메일을 보내 주시기 바랍니다. 또한www.facebook.com/indium또는@IndiumCorp에서 당사의 전문가 그룹인 From One Engineer ToAnother®(#FOETA)를 팔로우하실 수 있습니다.
