Indium Corporation has published 35 technical articles, 24 blog posts, and 14 videos to help members of the global electronics assembly industry solve voiding challenges.
“Voiding is one of the most prevalent challenges facing electronics manufacturers today,” said Christopher Bastecki, Associate Director of Electronics Assembly Materials. “Indium Corporation has spent years conducting extensive testing on materials and procedures to reduce voiding levels. As a result, we provide one of the most extensive libraries in the industry on this subject.”
The following technical articles are available at indiumstg.wpenginepowered.com/avoidthevoid:
- A Model Study of Profiling for Voiding Control at Lead-Free Reflow Soldering
- Best Practices Reflow Profiling for Lead-Free SMT Assembly
- Effect of Lead-Free Alloys on Voiding at Microvia
- High-Density Assembly and Root Cause Analyses
- High-Reliability No-Clean Solder Paste for Designs Where Flux Cannot be Dried
- High-Reliability, High-Melting, Mixed Lead-Free BiAgX® Solder Paste System
- How Stencil Design and Reflow Profiles Affect Variation in QFN Voiding
- How to Reduce Voiding in Components with Large Pads
- Influence of Reflow Profile and Pb-Free Solder Paste in Minimizing Voids for Quad
Flat-Pack No-Lead (QFN) Assembly - Minimizing Voiding in QFN Packages Using Solder Preforms
- Minimizing Voiding in SMT Assembly of BTCs
- New Developments in High-Performance Solder Products for Power Die Assemblies
- Optimizing Assembly of QFNs
- Process and Solder Paste Considerations for BGA and QFN Voiding in a Tin-Lead Mixed System
- QFN Voiding Control Via Solder Mask Patterning on Thermal Pads
- Reflow Soldering: Meeting the SMT Challenge
- Reliability Challenges for Bottom Termination Components
- Reliability of BiAgX® Solder as a Drop-In Solution for High-Temperature Lead-Free Die-Attach Applications
- Sealing the Gap of Solder Paste Technology in Lead-Free Halogen-Free Era
- The Benefits of Flux-Coated Solder Preforms in a QFN Assembly Process
- The Effect of Thermal Pad Patterning on QFN Voiding
- The Versatile Preform
- Thermal Pad Design and Process for Voiding Control at QFN Assembly
- Ultra-Low Voiding, Halogen-Free, No-Clean, Lead-Free Solder Paste for Large Pads
- Voiding and Reliability of Assembly of BGA with SAC and 57Bi/42Sn/1Ag Alloys
- Voiding and Reliability of BGA Assemblies with SAC and BiSnAg Alloys
- Voiding Behavior in Mixed Solder Alloy Systems
- Voiding Control Beneath BTCs Using Solder Fortification® Preforms
- Voiding Control for QFN Assembly
- Voiding in BGA at Solder Bumping Stage
- Voiding Mechanism and Control in Mixed Solder Alloy Systems
- Voiding Mechanism in BGA Assembly
- Voiding Mechanisms in SMT
- Voiding of Pb-Free Soldering at Microvia
- Voiding Reduction in BTC with Improved Flux Coating
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인듐 코퍼레이션(Indium Corporation)에 대한 자세한 정보는indiumstg.wpenginepowered.com을방문하거나[email protected]으로 이메일을 보내 주시기 바랍니다. 또한www.facebook.com/indium또는@IndiumCorp에서 당사의 전문가 그룹인 From One Engineer ToAnother®(#FOETA)를 팔로우하실 수 있습니다.
