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Should I be Afraid of Formic Acid?
I was asked by a customer (who I consider a friend), if I had any information about formic
Effect of Particle Size on Solder Paste (Part I)
A well-respected colleague asked this week if the metal loading of type '4' solder powder in a paste was lower than that for type '3' because the particles were smaller. The
A Model for Component Dipping
Dr. Andy Mackie recently put together a model to determine the probability that a componentcan besuccessfully dipped in solder paste or
Pb-Free Solders are Not the Cause of Tin Whiskers
A recent blog posting on Metroblogs titled, "Tin Whiskers sound harmless, don't they?" left me shaking my head regarding the association which is often made between Pb-Free Solder and
플럭스 액티베이터: 플럭스 액티베이터의 정의 / 역할
A colleague in California was on the phone last week: "We need a flux with greater activity!" He said. Choking down comments like "Maybe we can take it jogging next time you're in
Dispelling 10 Myths about Nitrogen Reflow (part II)
…and we’re back with more nitrogen and inert soldering myths.Part I of this post can be found here. Myth 6: “I turned on the nitrogen flow, so my oven is now inerted”Fact: It
Dispelling 10 Myths about Nitrogen Reflow (part I)
In my twenty years in the electronics manufacturing industry, I have heard a lot of claims made about the use of nitrogen in inerted soldering processes: many of them completely
SAC vs. Sn/Ag for Solar Soldering
As a discussion point (read "please feel free to disagree – that's what the comments section is for"), 96.5%Sn/3.5%Ag is NOT the most well suited pb-free alloy for tabbing. I know
The End of the Professor’s Second Visit to ACME
Folks, the adventures of The Professor continue……… So far the meeting with The Professor had proven very valuable John thought.He was anxious to hear the other suggestions that The
버스 리본이란 무엇인가요?
Bus ribbon is a very specialized interconnect for photovoltaic modules. Much like tabbing ribbon, bus ribbon is made of a copper ribbon or flat wire which is coated in solder. The solder protects the
No-Clean Flux
You may notice that many of the solar grade fluxes and solder pastes are designated 'no-clean'. This classification is used to describe a flux or flux vehicle that does not need to be removed
Au/Sn Perfected
Fact: To achieve a strong, reliable solder joint, it is important to remove all oxides from the substrate as well as the solder. Generally this is done using a compatible flux. Reality: Sometimes
The Professor Returns to ACME
Folks, Two weeks passed quickly and The Professor returned to ACME. Patty met him at the door. “Professor, it’s great to see you,” Patty said with enthusiasm. “We collected
Beyond The Theory of Constraints
Folks, Business was good at ACME. Even in these challenging times, the company's three assemblylines could not keep up with demand.John, themanger of the assembly lines, decided to request the
Soldering to Gold
In previous posts, we have mentioned soldering to gold, but never discussed the unique processing aspects related to this. Soldering to copper is straight-forward.It is done all the time and the
Common Cause vs Special Cause Defects
Folks, In teaching process optimization and failure analysis, one of the most helpful concepts is understanding he difference between common cause and special cause defects. A special cause defect,
Photovoltaics in EMS Sector
http://circuitsassembly.com/cms/component/content/article/199/7190-photovoltaics-in-ems-sector This article isn’t ‘hot off the press’, but it is worthy of review. In the October
Photovoltaics in EMS Sector
http://circuitsassembly.com/cms/component/content/article/199/7190-photovoltaics-in-ems-sector This article isn't 'hot off the press', but it is worthy of review. In the October 2008
Au/Sn Sputtering Targets
In addition to Au/Sn sputtering pucks, Indium Corporation can also manufacture full size Au/Sn sputtering targets. 80Au/20Sn is a versatile solder that is used in a wide variety of specialty
Solderspatter: Solder Paste in Unexpected Places
Figure 1: Solderspatter (soldersplash) on Gold/Nickel Figure 2: Phase Inversion during Reflow Most people are aware that solder paste is a mixture of solder powder and a flux
"볼 드롭" 구체 배치 이론
After transferring flux, align the stencil Setup print parameters to minimize doubles and missing solder spheres Remove stencil, substrate/die should be ready for inspection and reflow Spheres can be
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도와드리겠습니다.
Indium은 현재와 미래, 그리고 미래의 과제를 해결하기 위한 첨단 전자 조립 재료 솔루션을 연구, 개발 및 제조합니다.

