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Photovoltaics in EMS Sector
http://circuitsassembly.com/cms/component/content/article/199/7190-photovoltaics-in-ems-sector This article isn’t ‘hot off the press’, but it is worthy of review. In the October
Photovoltaics in EMS Sector
http://circuitsassembly.com/cms/component/content/article/199/7190-photovoltaics-in-ems-sector This article isn't 'hot off the press', but it is worthy of review. In the October 2008
Au/Sn Sputtering Targets
In addition to Au/Sn sputtering pucks, Indium Corporation can also manufacture full size Au/Sn sputtering targets. 80Au/20Sn is a versatile solder that is used in a wide variety of specialty
Solderspatter: Solder Paste in Unexpected Places
Figure 1: Solderspatter (soldersplash) on Gold/Nickel Figure 2: Phase Inversion during Reflow Most people are aware that solder paste is a mixture of solder powder and a flux
Theory of “Ball Drop” Sphere Placement
After transferring flux, align the stencil Setup print parameters to minimize doubles and missing solder spheres Remove stencil, substrate/die should be ready for inspection and reflow Spheres can be
Sn/Cu合金はソルダーペーストに適しているか?
Folks I was chatting recently with Indium Corporation's Mike Fenner about Sn/Cu alloys for solder paste.Mike has many years of experience and I value his opinions greatly. Here is a summary of
Indium and Flip Chip Bonding
Au stud bumped flip chip attachment? Low temperature assembly requirements? Indium is your answer… Indium can be used in many ingenious ways to attach flip chips. It can be used for solder
Solderability Testing of Die-Attach Solder Paste
Diagram of Solder-Dipping Test Apparatus Solder-wetting Curve Interesting question from a Power Semiconductor customer this week about how to test solder paste for use in Power die-attach
Ed Briggs Weighs in on “Graping”
Folks, Recently I caught up with Ed Briggs, a member of Indium Corporation's technical staff. I asked Ed if he would share with us his thoughts on "graping" and how to minimize it. His
液体金属熱界面材料 1
Liquid thermal interface materials are available in two forms: The major difference between the two is in the temperature which these alloys become molten. Liquid metals remain molten at room
Indium Foil – a Thermal Interface Material
Indium Foil used as a thermal interface can easily be handled with pick and place tools. Never worked with indium foil and wondering, "What's all the hype about?" In many ways, indium
Hand Soldering Tip Temperatures
How hot are you setting your solder iron for hand soldering using solder wire or preforms? If you are cranking up the solder iron temperature because you have transitioned to lead-free solders, think
インジウム接合とインジウム冷間溶接
ここ数日、私のアプリケーション・エンジニア仲間の一人であるジム・ヒサートが、インジウム接合とインジウム冷間溶接について、彼の半導体ウェブサイトにブログを投稿した。この話題は
Pin Transfer Basics
This is the shape of flux deposits left after pin transfer Spheres attached after pin transfer Pin transfer is a way of selectively depositing a semi-solid or liquid material (like a solder paste or
Determine Solidus and Liquidus Temperatures of Solder Thermal Interface Materials
As previously posted, Indiums Table of Specialty Alloys and Solders contains hundreds of solder alloys used as thermal interface materials and for each of them, we have listed melting temperatures.
Determine Solidus and Liquidus Temperatures of Solder Alloys
As previously posted, Indiums Table of Specialty Alloys҂and solderscontains hundreds of solder alloys and for each of them, we have listed melting temperatures. The method by which these were
サーマル・テスターの皆様へ
サーマル・マテリアルのトラブルシューティングや最適化の方法をお探しですか?サーマル・インターフェースを除いたサーマル・スタックアップの性能を判断するために、私たちが考案した方法のひとつです。
Au/Sn (Everyone’s Best Friend)
Our engineering group recently recieved a personal win when a prospective customer we have been working with for years finally took notice of out Au/Sn advancements and agreed to run a full
Clad Thermal Interface Materials
Continuing with the topic of thermal interface material options, a popular material choice is a clad metal thermal interface preform including multiple layers of various metals, or a metal preform
お困りですか?
インジウムでは、今日、明日、そして未来の課題に対する高度なエレクトロニクス組立材料のソリューションを研究、開発、製造しています。

