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Photovoltaics in EMS Sector

http://circuitsassembly.com/cms/component/content/article/199/7190-photovoltaics-in-ems-sector This article isn’t ‘hot off the press’, but it is worthy of review. In the October

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Photovoltaics in EMS Sector

http://circuitsassembly.com/cms/component/content/article/199/7190-photovoltaics-in-ems-sector This article isn't 'hot off the press', but it is worthy of review. In the October 2008

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Au/Sn Sputtering Targets

In addition to Au/Sn sputtering pucks, Indium Corporation can also manufacture full size Au/Sn sputtering targets. 80Au/20Sn is a versatile solder that is used in a wide variety of specialty

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Solderspatter: Solder Paste in Unexpected Places

Figure 1: Solderspatter (soldersplash) on Gold/Nickel Figure 2: Phase Inversion during Reflow Most people are aware that solder paste is a mixture of solder powder and a flux

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Theory of “Ball Drop” Sphere Placement

After transferring flux, align the stencil Setup print parameters to minimize doubles and missing solder spheres Remove stencil, substrate/die should be ready for inspection and reflow Spheres can be

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锡/铜合金是焊膏的理想选择吗?

Folks I was chatting recently with Indium Corporation's Mike Fenner about Sn/Cu alloys for solder paste.Mike has many years of experience and I value his opinions greatly. Here is a summary of

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Indium and Flip Chip Bonding

Au stud bumped flip chip attachment? Low temperature assembly requirements? Indium is your answer… Indium can be used in many ingenious ways to attach flip chips. It can be used for solder

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铟相图

If you deal with indium, this is a book for you. “Phase Diagrams of Indium Alloys and Their Engineering Applications” has information about pure indium and indium

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Solderability Testing of Die-Attach Solder Paste

Diagram of Solder-Dipping Test Apparatus Solder-wetting Curve Interesting question from a Power Semiconductor customer this week about how to test solder paste for use in Power die-attach

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Ed Briggs Weighs in on “Graping”

Folks, Recently I caught up with Ed Briggs, a member of Indium Corporation's technical staff. I asked Ed if he would share with us his thoughts on "graping" and how to minimize it. His

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液态金属热界面材料 1

Liquid thermal interface materials are available in two forms: The major difference between the two is in the temperature which these alloys become molten. Liquid metals remain molten at room

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Indium Foil – a Thermal Interface Material

Indium Foil used as a thermal interface can easily be handled with pick and place tools. Never worked with indium foil and wondering, "What's all the hype about?" In many ways, indium

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Hand Soldering Tip Temperatures

How hot are you setting your solder iron for hand soldering using solder wire or preforms? If you are cranking up the solder iron temperature because you have transitioned to lead-free solders, think

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铟结合和铟冷焊

最近几天,我的一位应用工程师同事 Jim Hisert 在他的半导体网站上发表了一篇关于铟接合和铟冷焊的博客。这是一个经常出现的话题,既

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Stock Up

I recently visited a customer to help optimize a flux-less indium soldering application. They admitted they needed flux but didn’t know 1) what to use, or 2) if there was a better way to fix

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Pin Transfer Basics

This is the shape of flux deposits left after pin transfer Spheres attached after pin transfer Pin transfer is a way of selectively depositing a semi-solid or liquid material (like a solder paste or

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确定焊料热界面材料的固相温度和液相温度

As previously posted, Indiums Table of Specialty Alloys and Solders contains hundreds of solder alloys used as thermal interface materials and for each of them, we have listed melting temperatures.

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Determine Solidus and Liquidus Temperatures of Solder Alloys

As previously posted, Indiums Table of Specialty Alloys҂and solderscontains hundreds of solder alloys and for each of them, we have listed melting temperatures. The method by which these were

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热测试人员请注意

您在寻找排除故障或优化热界面材料的方法吗?我们设计了一种方法来确定热叠层的性能,但不包括热界面

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Au/Sn (Everyone’s Best Friend)

Our engineering group recently recieved a personal win when a prospective customer we have been working with for years finally took notice of out Au/Sn advancements and agreed to run a full

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包覆热界面材料

Continuing with the topic of thermal interface material options, a popular material choice is a clad metal thermal interface preform including multiple layers of various metals, or a metal preform

在 Indium,我们研究、开发和制造先进的电子组装材料解决方案,以应对当今、未来和未来的挑战。