Indium Corporation will feature NC-SMQ®75 die-attach solder paste at Productronica China March 17-19, 2015, at the Shanghai New International Expo Centre in Shanghai, China.
NC-SMQ75 is an ultralow residue, halogen-free, die-attach solder paste that leaves a completely benign, almost undetectable, residue of approximately 0.4 weight percent of paste. It is designed for reflow in a nitrogen or forming gas atmosphere of 100 ppm oxygen or less and can survive the high temperatures associated with both high-lead (Pb) and gold-tin alloy reflow.
This product is designed to eliminate the cleaning step in power semiconductor assembly, especially in clip-bonding and similar applications that do not use a wirebond. The post-reflow residue has been certified "Power-Safe" and approved to MSL1, 2, and 3 by multiple customers in Asia.
Indium Corporation will be at booth 1368 in Hall E1 at Productronica China.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
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