Indium Corporation will feature NC-SMQ®75 die-attach solder paste at Productronica China March 17-19, 2015, at the Shanghai New International Expo Centre in Shanghai, China.
NC-SMQ75 is an ultralow residue, halogen-free, die-attach solder paste that leaves a completely benign, almost undetectable, residue of approximately 0.4 weight percent of paste. It is designed for reflow in a nitrogen or forming gas atmosphere of 100 ppm oxygen or less and can survive the high temperatures associated with both high-lead (Pb) and gold-tin alloy reflow.
This product is designed to eliminate the cleaning step in power semiconductor assembly, especially in clip-bonding and similar applications that do not use a wirebond. The post-reflow residue has been certified "Power-Safe" and approved to MSL1, 2, and 3 by multiple customers in Asia.
Indium Corporation will be at booth 1368 in Hall E1 at Productronica China.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、太陽電池、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがあります。1934年に設立されたインジウムは、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を有しています。
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