Indium Corporation will feature NC-SMQ®75 die-attach solder paste at Productronica China March 17-19, 2015, at the Shanghai New International Expo Centre in Shanghai, China.
NC-SMQ75 is an ultralow residue, halogen-free, die-attach solder paste that leaves a completely benign, almost undetectable, residue of approximately 0.4 weight percent of paste. It is designed for reflow in a nitrogen or forming gas atmosphere of 100 ppm oxygen or less and can survive the high temperatures associated with both high-lead (Pb) and gold-tin alloy reflow.
This product is designed to eliminate the cleaning step in power semiconductor assembly, especially in clip-bonding and similar applications that do not use a wirebond. The post-reflow residue has been certified "Power-Safe" and approved to MSL1, 2, and 3 by multiple customers in Asia.
Indium Corporation will be at booth 1368 in Hall E1 at Productronica China.
铟泰公司 面向全球电子、半导体、太阳能、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持体系，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
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