Indium Corporation’s Seven Liang, Area Technical Manager for Shenzhen, will share his technical expertise at the CEIA Guiyang Seminar on July 26 in Guiyang, China.
Liang’s presentation, How Solder Materials Influence Reliability, will review how materials can be used to solve some of the top industry challenges including head-in-pillow, non-wet opens, graping, and SIR performance. He will also discuss what materials to use to ensure the high reliability of the final assembly and share the methods and test results of high-reliability alloys.
Indium Corporation will also be exhibiting at the seminar. Their booth will feature their high-reliability, low-voiding products, such as Indium8.9HF Solder Paste, Indium10.1HF Solder Paste, and precision gold-tin preforms. Technical experts will be available at the booth to answer questions about the presentation and help resolve customers’ assembly challenges.
Liang provides technical support for Indium Corporation’s electronics assembly materials, semiconductor and advanced assembly materials, engineered solders, and thermal management materials. He has more than a decade of experience in surface mount technology.
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 이 회사는 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts From One Engineer To Another® (#FOETA) at www.facebook.com/indium or @IndiumCorp.
