Indium Corporation’s Seven Liang, Area Technical Manager for Shenzhen, will share his technical expertise at the CEIA Guiyang Seminar on July 26 in Guiyang, China.
Liang’s presentation, How Solder Materials Influence Reliability, will review how materials can be used to solve some of the top industry challenges including head-in-pillow, non-wet opens, graping, and SIR performance. He will also discuss what materials to use to ensure the high reliability of the final assembly and share the methods and test results of high-reliability alloys.
Indium Corporation will also be exhibiting at the seminar. Their booth will feature their high-reliability, low-voiding products, such as Indium8.9HF Solder Paste, Indium10.1HF Solder Paste, and precision gold-tin preforms. Technical experts will be available at the booth to answer questions about the presentation and help resolve customers’ assembly challenges.
Liang provides technical support for Indium Corporation’s electronics assembly materials, semiconductor and advanced assembly materials, engineered solders, and thermal management materials. He has more than a decade of experience in surface mount technology.
铟泰公司 是一家面向全球电子、半导体、薄膜及热管理 市场的顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊 ；热界面材料；溅射靶材 ；铟、镓（Ga） 、锗和锡等金属及无机材料化合物 ；以及NanoFoil®。该公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚 、新加坡 、韩国、英国和美国设有工厂。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts From One Engineer To Another® (#FOETA) at www.facebook.com/indium or @IndiumCorp.
