Indium Corporation's Pony Liao, Area Technical Manager – Northern China, will present a technical paper at the IPC Beijing Technology Seminar on June 19 in Beijing, China.
One of the biggest challenges facing the electronics industry today is voiding in the solder joints that connect bottom-terminated electronic components to PCBs. Liao's presentation, Voiding Control Beneath Bottom-Terminated Components Using Solder Fortification® Preforms, looks at a novel technique that uses Solder Fortification® Preforms for an easy and inexpensive process modification that both decreases the level of voiding and also decreases the amount of variation in this value.
Liao provides technical support for Indium Corporation's electronics assembly materials, semiconductor and advanced assembly materials, engineered solders, and thermal management materials. He has over 10 years of experience in surface mount technology, specializing in defect prevention, continuous quality improvement, and cost reduction. Liao has a bachelor's degree from Tianjin University in mechanical and electronics engineering.
IPC is a global trade association dedicated to furthering the competitive excellence and financial success of its electronics industry members. For more information about upcoming presentations, visit www.ipc.org.cn/Events/Technology-Seminar/2015/default.htm.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
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