Indium Corporation's Pony Liao, Area Technical Manager – Northern China, will present a technical paper at the IPC Beijing Technology Seminar on June 19 in Beijing, China.
One of the biggest challenges facing the electronics industry today is voiding in the solder joints that connect bottom-terminated electronic components to PCBs. Liao's presentation, Voiding Control Beneath Bottom-Terminated Components Using Solder Fortification® Preforms, looks at a novel technique that uses Solder Fortification® Preforms for an easy and inexpensive process modification that both decreases the level of voiding and also decreases the amount of variation in this value.
Liao provides technical support for Indium Corporation's electronics assembly materials, semiconductor and advanced assembly materials, engineered solders, and thermal management materials. He has over 10 years of experience in surface mount technology, specializing in defect prevention, continuous quality improvement, and cost reduction. Liao has a bachelor's degree from Tianjin University in mechanical and electronics engineering.
IPC is a global trade association dedicated to furthering the competitive excellence and financial success of its electronics industry members. For more information about upcoming presentations, visit www.ipc.org.cn/Events/Technology-Seminar/2015/default.htm.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer ToAnother®(#FOETA)。
