Indium Corporation's Pony Liao, Area Technical Manager – Northern China, will present a technical paper at the IPC Beijing Technology Seminar on June 19 in Beijing, China.
One of the biggest challenges facing the electronics industry today is voiding in the solder joints that connect bottom-terminated electronic components to PCBs. Liao's presentation, Voiding Control Beneath Bottom-Terminated Components Using Solder Fortification® Preforms, looks at a novel technique that uses Solder Fortification® Preforms for an easy and inexpensive process modification that both decreases the level of voiding and also decreases the amount of variation in this value.
Liao provides technical support for Indium Corporation's electronics assembly materials, semiconductor and advanced assembly materials, engineered solders, and thermal management materials. He has over 10 years of experience in surface mount technology, specializing in defect prevention, continuous quality improvement, and cost reduction. Liao has a bachelor's degree from Tianjin University in mechanical and electronics engineering.
IPC is a global trade association dedicated to furthering the competitive excellence and financial success of its electronics industry members. For more information about upcoming presentations, visit www.ipc.org.cn/Events/Technology-Seminar/2015/default.htm.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、太陽電池、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがあります。1934年に設立されたインジウムは、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を有しています。
インジウム・コーポレーションについての詳細は、www.indium.comをご覧いただくか、[email protected] まで電子メールでお問い合わせください。また、当社の専門家であるFrom One Engineer ToAnother®(#FOETA)を、www.facebook.com/indiumまたは@IndiumCorp でフォローすることもできます。
