Indium Corporation’s Kim Flanagan, Technical Support Engineer, will present at SMTA Capital’s Expo & Tech Forum on August 23 in Laurel, Maryland.
Bottom termination component (BTC) use has increased substantially over the past decade, with today’s assemblies often encompassing various types of BTCs within one assembly. Flanagan’s presentation, Avoiding the Pitfalls of Voiding in PCB Assemblies, tells us how the industry has explored process modifications to assist with achieving the lowest voiding in large ground plane solder joints through optimizing pad design, pad patterning, stencil design, via positioning, solid solder addition, and reflow profiles. This presentation discusses how IPC’s recommendations for design and implementation of BTCs and impending changes to IPC-7093 can help minimize voiding and ensure robust BTC assemblies.
Flanagan provides technical support and guidance on process steps, equipment, techniques, and materials to customers. In addition, she provides technical training to staff and industry partners. Flanagan began her career with Indium Corporation through the company’s summer college internship program, working in the Quality Department. She remained with Indium Corporation as a part-time Quality Engineering Technician while she finished her bachelor’s degree in Physics from Le Moyne College and joined the technical support team in December 2016.
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 이 회사는 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인듐 코퍼레이션(Indium Corporation)에 대한 자세한 정보는 indiumstg.wpenginepowered.com을 방문하거나 [email protected]으로 이메일을 보내 주시기 바랍니다. 또한 www.facebook.com/indium 또는 @IndiumCorp에서 당사의 전문가 그룹인 ‘From One Engineer ToAnother® (#FOETA)’를 팔로우하실 수 있습니다.
