Indium Corporation’s Kim Flanagan, Technical Support Engineer, will present at SMTA Capital’s Expo & Tech Forum on August 23 in Laurel, Maryland.
Bottom termination component (BTC) use has increased substantially over the past decade, with today’s assemblies often encompassing various types of BTCs within one assembly. Flanagan’s presentation, Avoiding the Pitfalls of Voiding in PCB Assemblies, tells us how the industry has explored process modifications to assist with achieving the lowest voiding in large ground plane solder joints through optimizing pad design, pad patterning, stencil design, via positioning, solid solder addition, and reflow profiles. This presentation discusses how IPC’s recommendations for design and implementation of BTCs and impending changes to IPC-7093 can help minimize voiding and ensure robust BTC assemblies.
Flanagan provides technical support and guidance on process steps, equipment, techniques, and materials to customers. In addition, she provides technical training to staff and industry partners. Flanagan began her career with Indium Corporation through the company’s summer college internship program, working in the Quality Department. She remained with Indium Corporation as a part-time Quality Engineering Technician while she finished her bachelor’s degree in Physics from Le Moyne College and joined the technical support team in December 2016.
铟泰公司 是一家面向全球电子、半导体、薄膜及热管理 市场的顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊 ；热界面材料；溅射靶材 ；铟、镓（Ga） 、锗和锡等金属及无机材料化合物 ；以及NanoFoil®。该公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚 、新加坡 、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
