Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, will share his knowledge on soldering technologies at SMTConnect Technology Days English Seminar Program, May 7-9, Nuremberg, Germany.
Dr. Lee’s full-day seminars on Wednesday, May 8, will include:
- Solder Paste Technology Assessment for Miniaturization provides an analysis on how current solder paste technology can support the industry’s continuing miniaturization trends, such as system-in-package (SiP) and 01005 printing.
- Achieving High-Reliability for Lead-Free Solder Joints – Materials Consideration provides participants with an understanding of how various factors can contribute to failure modes, and how to select proper solder alloys and surface finishes for achieving high-reliability.
- DFM for Advanced Soldering, helps participants to learn how to efficiently assemble and test to save time and money.
Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and an IEEE Fellow. He has extensive experience in the development of fluxes, alloys, and solder pastes for the SMT industries, and extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials.
To view papers authored by Dr. Lee and other Indium Corporation experts, visit www.indium.com/techlibrary.
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 이 회사는 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인디엄 코퍼레이션에 대한 자세한 정보는 www.indium.com 또는 이메일 ([email protected])로 문의하세요 . 또한 From One Engineer To Another® (#FOETA)의 전문가를 www.facebook.com/indium 또는 @IndiumCorp에서 팔로우할 수도 있습니다.
