Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, will share his knowledge on soldering technologies at SMTConnect Technology Days English Seminar Program, May 7-9, Nuremberg, Germany.
Dr. Lee’s full-day seminars on Wednesday, May 8, will include:
- Solder Paste Technology Assessment for Miniaturization provides an analysis on how current solder paste technology can support the industry’s continuing miniaturization trends, such as system-in-package (SiP) and 01005 printing.
- Achieving High-Reliability for Lead-Free Solder Joints – Materials Consideration provides participants with an understanding of how various factors can contribute to failure modes, and how to select proper solder alloys and surface finishes for achieving high-reliability.
- DFM for Advanced Soldering, helps participants to learn how to efficiently assemble and test to save time and money.
Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and an IEEE Fellow. He has extensive experience in the development of fluxes, alloys, and solder pastes for the SMT industries, and extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials.
To view papers authored by Dr. Lee and other Indium Corporation experts, visit www.indium.com/techlibrary.
Indium Corporation 是全球电子、半导体、薄膜和热管理市场的主要材料制造商和供应商。产品包括焊料和助焊剂；钎料；热界面材料；溅射靶材；铟、镓、锗、锡金属和无机化合物；以及 NanoFoil®。公司成立于 1934 年，拥有全球技术支持，在中国、马来西亚、新加坡、韩国、英国和美国均设有工厂。
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