Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, will share his knowledge on soldering technologies at SMTConnect Technology Days English Seminar Program, May 7-9, Nuremberg, Germany.
Dr. Lee’s full-day seminars on Wednesday, May 8, will include:
- Solder Paste Technology Assessment for Miniaturization provides an analysis on how current solder paste technology can support the industry’s continuing miniaturization trends, such as system-in-package (SiP) and 01005 printing.
- Achieving High-Reliability for Lead-Free Solder Joints – Materials Consideration provides participants with an understanding of how various factors can contribute to failure modes, and how to select proper solder alloys and surface finishes for achieving high-reliability.
- DFM for Advanced Soldering, helps participants to learn how to efficiently assemble and test to save time and money.
李博士是世界知名的焊接專家，同時也是 SMTA 傑出會員及 IEEE 會士。他在表面貼裝技術（SMT）產業的助焊劑、合金及焊錫膏開發方面擁有豐富經驗，並在高溫聚合物、微電子封裝材料、底填料及黏合劑的開發領域具備深厚造詣。 除了表面貼裝技術（SMT）與半導體焊接材料外，他的研究範圍還延伸至奈米鍵合技術與導熱材料。
To view papers authored by Dr. Lee and other Indium Corporation experts, visit indiumstg.wpenginepowered.com/techlibrary.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
如需進一步了解 Indium Corporation，請造訪indiumstg.wpenginepowered.com或發送電子郵件至 [email protected]。您也可以在www.facebook.com/indium或@IndiumCorp 追蹤我們的專家團隊「From One Engineer ToAnother®」（#FOETA）。
