Indium Corporation’s Graham Wilson, Applications Engineer, will give a poster presentation at TEC Lund on Sept. 27 in Lund, Sweden.
Wilson will present High-Power Device Assembly: A Reinforced Matrix Solder Preform Solution for Bondline Control & Increased Reliability. This presentation explores how a solder preform with a reinforced matrix can maintain bondline coplanarity, improve reliability, and reduce the overall cost of ownership for a substrate as compared to current techniques, such as stamped bumps or stitched wire bonds on the substrate.
Wilson is a Senior Applications Engineer for Indium Corporation’s European operations. He supports customers with comprehensive technical advice on the selection, use, and application of solder pastes, fluxes, and engineered solders. He has more than 20 years of experience spanning a number of industries, including a focus on electronics assembly and thermal management. He is certified as a Six Sigma Green Belt through the Thayer School of Engineering at Dartmouth and shares his expertise at conferences internationally. Wilson earned his degree in HNC Electronics from the University of Northampton.
TEC Lund features discussions and exhibits on advanced and emerging technologies in printed circuit board design, the current component situation, as well as the latest innovations within electronics assembly technologies. Indium Corporation will also be exhibiting at this event.
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 이 회사는 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
