Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, and other company experts will present at SMTA’s South East Asia Technical Conference on Electronics Assembly Technologies 2017, March 28-30, in Penang, Malaysia.
Dr. Lee will instruct a two-part seminar on Choosing Solders for the New Era on Tuesday, March 28. Part one will take place from 8:30 a.m. to noon and focus on lead-free solder alloys, and part two will run from 1:30-5 p.m. and discuss low-temperature solders.
Jonas Sjoberg, Technical Manager, will chair the Advanced Packaging session on Thursday, March 30.
Technical presentations by Indium Corporation experts include:
- Voiding Control at LED Die-Attach Preform Soldering by Dr. Lee
- Assessment of Solder Paste Technology Limitation for Printing Applications by Dr. Lee
- Process Optimization for Cold Joint and Tombstone Improvement in SiP Package by Jason Chou, Area Technical Manager – Taiwan
- System-in-Package (SiP) Assembly vs. Solder Paste Attributes by Kenneth Thum, Senior Technical Support Engineer
For more information on the technical sessions offered at SMTA’s South East Asia Technical Conference, visit www.smta.org/southeast-asia.
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
