Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, and other company experts will present at SMTA’s South East Asia Technical Conference on Electronics Assembly Technologies 2017, March 28-30, in Penang, Malaysia.
Dr. Lee will instruct a two-part seminar on Choosing Solders for the New Era on Tuesday, March 28. Part one will take place from 8:30 a.m. to noon and focus on lead-free solder alloys, and part two will run from 1:30-5 p.m. and discuss low-temperature solders.
Jonas Sjoberg, Technical Manager, will chair the Advanced Packaging session on Thursday, March 30.
Technical presentations by Indium Corporation experts include:
- Voiding Control at LED Die-Attach Preform Soldering by Dr. Lee
- Assessment of Solder Paste Technology Limitation for Printing Applications by Dr. Lee
- Process Optimization for Cold Joint and Tombstone Improvement in SiP Package by Jason Chou, Area Technical Manager – Taiwan
- System-in-Package (SiP) Assembly vs. Solder Paste Attributes by Kenneth Thum, Senior Technical Support Engineer
For more information on the technical sessions offered at SMTA’s South East Asia Technical Conference, visit www.smta.org/southeast-asia.
铟泰公司 面向全球电子、半导体、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
