Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, and other company experts will present at SMTA’s South East Asia Technical Conference on Electronics Assembly Technologies 2017, March 28-30, in Penang, Malaysia.
Dr. Lee will instruct a two-part seminar on Choosing Solders for the New Era on Tuesday, March 28. Part one will take place from 8:30 a.m. to noon and focus on lead-free solder alloys, and part two will run from 1:30-5 p.m. and discuss low-temperature solders.
Jonas Sjoberg, Technical Manager, will chair the Advanced Packaging session on Thursday, March 30.
Technical presentations by Indium Corporation experts include:
- Voiding Control at LED Die-Attach Preform Soldering by Dr. Lee
- Assessment of Solder Paste Technology Limitation for Printing Applications by Dr. Lee
- Process Optimization for Cold Joint and Tombstone Improvement in SiP Package by Jason Chou, Area Technical Manager – Taiwan
- System-in-Package (SiP) Assembly vs. Solder Paste Attributes by Kenneth Thum, Senior Technical Support Engineer
For more information on the technical sessions offered at SMTA’s South East Asia Technical Conference, visit www.smta.org/southeast-asia.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、および熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがあります。1934年に設立されたインジウムは、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を有しています。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
