Indium Corporation will feature Indium8.9HF, a halogen-free, no-clean solder paste with excellent performance stability during printing, at the SMTA International Conference Sept. 27-Oct. 1 in Rosemont, Ill.
Pb-free Indium8.9HF is perfectly suited for a wide variety of applications, including automotive, consumer and communications. This is due to its high print transfer efficiency and robust reflow process window capability. With reliable performance stability during usage, a clear, probe-testable flux residue, and a resilient oxidation barrier for strong head-in-pillow and graping resistance, Indium8.9HF is our best all-round performing solder paste.
Indium8.9HF Solder Paste is part of Indium Corporation’s Pb-free series of solder pastes. The series was designed to provide multi-faceted performance characteristics, bringing the right balance of solder paste attributes tailored specifically to each manufacturing process. Every paste in the series was developed to optimize print performance and mitigate common defects faced by manufacturers of personal electronics, such as QFN voiding, head-in-pillow, and graping.
For more information about Indium8.9HF or the Indium Pb-free series of solder pastes, visit www.indium.com/indium8.9series or stop at Indium Corporation’s booth #430.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인디엄 코퍼레이션에 대한 자세한 정보는 www.indium.com 또는 이메일 ([email protected])로 문의하세요 . 또한 From One Engineer To Another® (#FOETA)의 전문가를 www.facebook.com/indium 또는 @IndiumCorp에서 팔로우할 수도 있습니다.
