Indium Corporation will feature Indium8.9HF, a halogen-free, no-clean solder paste with excellent performance stability during printing, at the SMTA International Conference Sept. 27-Oct. 1 in Rosemont, Ill.
Pb-free Indium8.9HF is perfectly suited for a wide variety of applications, including automotive, consumer and communications. This is due to its high print transfer efficiency and robust reflow process window capability. With reliable performance stability during usage, a clear, probe-testable flux residue, and a resilient oxidation barrier for strong head-in-pillow and graping resistance, Indium8.9HF is our best all-round performing solder paste.
Indium8.9HF Solder Paste is part of Indium Corporation’s Pb-free series of solder pastes. The series was designed to provide multi-faceted performance characteristics, bringing the right balance of solder paste attributes tailored specifically to each manufacturing process. Every paste in the series was developed to optimize print performance and mitigate common defects faced by manufacturers of personal electronics, such as QFN voiding, head-in-pillow, and graping.
For more information about Indium8.9HF or the Indium Pb-free series of solder pastes, visit www.indium.com/indium8.9series or stop at Indium Corporation’s booth #430.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、太陽電池、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがあります。1934年に設立されたインジウムは、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を有しています。
インジウム・コーポレーションについての詳細は、www.indium.comをご覧いただくか、[email protected] まで電子メールでお問い合わせください。また、当社の専門家であるFrom One Engineer ToAnother®(#FOETA)を、www.facebook.com/indiumまたは@IndiumCorp でフォローすることもできます。
