Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology will present a technical paper at the 9th International Microsystems, Packaging, Assembly, Circuits Technology Conference (IMPACT), Oct. 22-24 in Taipei, Taiwan.
Dr. Lee will present Voiding and Reliability of BGA Assemblies Produced with SAC and BiSnAg Solder Alloys. This presentation explores the effects of BiSnAg, as a replacement for SAC solder alloys, on joint mechanical strength, drop test performance, and voiding performance.
IMPACT is a two-day event that is the largest gathering of packaging and PCB assembly professionals in Taiwan. For more information, visit www.impact.org.tw.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on both high performance and low cost of ownership.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
