Indium Corporation‘s Principal Engineer Advanced Materials, Andy C. Mackie, Ph.D., MSc, is scheduled to deliver an insightful presentation on advanced packaging and heterogeneous integration as part of India Electronics Week. As part of one of the largest conferences on electronics in Asia, the presentation is scheduled for 12:00 p.m. local time on February 2 at KTPO Whitefield in Bengaluru, India.
The presentation, titled Trends in Advanced Packaging and Heterogeneous Integration, will examine the chiplet economy and the disappearance of silicon. Dr. Mackie will also seek to explore the evolution of digital and power electronics assembly among other topics.
“One of the primary questions we will seek to answer in this presentation is what precisely makes ‘advanced packaging’ advanced?” said Dr. Mackie. “I look forward to tackling this issue and more with my colleagues in the context of future trends in advanced packaging and heterogeneous integration.”
Dr. Mackie focuses on identifying the intersection of novel materials, emerging technologies, and their potential business impact. His professional experience covers all aspects of materials and processes for electronics manufacturing from wafer fabrication to semiconductor assembly and packaging and SMT/electronics assembly. Dr. Mackie holds a Ph.D. in physical chemistry from the University of Nottingham, UK, and a Master’s of Science (MSc) in physical chemistry and surface science from the University of Bristol, UK.
인디엄 코퍼레이션 소개
Indium Corporation 은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재 정제, 제련, 제조 및 공급업체입니다. 제품에는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil 이 포함됩니다. 1934년에 설립된 이 회사는 중국, 독일, 인도, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인디엄 코퍼레이션에 대한 자세한 정보는 www.indium.com 또는 징야 황에게 이메일을 보내주세요. 또한 www.linkedin.com/company/indium-corporation/ 에서 전문가를 팔로우할 수 있습니다. (#FOETA).
