Indium Corporation‘s Principal Engineer Advanced Materials, Andy C. Mackie, Ph.D., MSc, is scheduled to deliver an insightful presentation on advanced packaging and heterogeneous integration as part of India Electronics Week. As part of one of the largest conferences on electronics in Asia, the presentation is scheduled for 12:00 p.m. local time on February 2 at KTPO Whitefield in Bengaluru, India.
The presentation, titled Trends in Advanced Packaging and Heterogeneous Integration, will examine the chiplet economy and the disappearance of silicon. Dr. Mackie will also seek to explore the evolution of digital and power electronics assembly among other topics.
“One of the primary questions we will seek to answer in this presentation is what precisely makes ‘advanced packaging’ advanced?” said Dr. Mackie. “I look forward to tackling this issue and more with my colleagues in the context of future trends in advanced packaging and heterogeneous integration.”
Dr. Mackie focuses on identifying the intersection of novel materials, emerging technologies, and their potential business impact. His professional experience covers all aspects of materials and processes for electronics manufacturing from wafer fabrication to semiconductor assembly and packaging and SMT/electronics assembly. Dr. Mackie holds a Ph.D. in physical chemistry from the University of Nottingham, UK, and a Master’s of Science (MSc) in physical chemistry and surface science from the University of Bristol, UK.
インジウム・コーポレーションについて
インジウム・コーポレーション は、世界のエレクトロニクス、半導体、薄膜、サーマルマネージメント市場向けの一流の材料精製、製錬、製造、サプライヤーである。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil などがある。1934年に設立され、グローバルな技術サポートと中国、ドイツ、インド、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
インジウム・コーポレーションについての詳細は、www.indium.comをご覧いただくか、Jingya HuangまでEメールにてお問い合わせください。また、当社の専門家、From One Engineer To Another (#FOETA)をフォローすることもできます。www.linkedin.com/company/indium-corporation/。
