Indium Corporation’s Derrick Herron, technical support engineer, will serve as an expert presenter at ZESTRON’s Assembly, Cleaning, and Reliability Hands-on Workshop on June 10 in Franklin, Mass.
Herron will present Various Ways to Minimize Voiding Under Bottom Terminated Components. This discussion will include the common challenge in SMT of voiding under bottom-terminated packages. Voids in the solder joints can lead to hot spots and component damage. Herron will outline possible ways to combat this challenge, including changes in stencil design, changes in board pad design, or the use of solder preforms. For more information on this workshop, visit www.zestron.com.
Herron has worked with the world renowned Dr. Ning-Cheng Lee in Indium Corporation's research and development laboratory for more than five years. In addition, his work with Indium Corporation’s Dr. Yan Liu focused on developments in solder paste and flux technologies. He has co-authored several research papers on the topic of QFN voiding. Herron has a bachelor’s degree in chemistry from Oklahoma State University, Stillwater, Oklahoma. He earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College and was certified in IPC-A-600 and IPC-A-610-D.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인디엄 코퍼레이션에 대한 자세한 내용은 www.indium.com 또는 이메일 ([email protected])로 문의하세요.
