Indium Corporation’s Derrick Herron, technical support engineer, will serve as an expert presenter at ZESTRON’s Assembly, Cleaning, and Reliability Hands-on Workshop on June 10 in Franklin, Mass.
Herron will present Various Ways to Minimize Voiding Under Bottom Terminated Components. This discussion will include the common challenge in SMT of voiding under bottom-terminated packages. Voids in the solder joints can lead to hot spots and component damage. Herron will outline possible ways to combat this challenge, including changes in stencil design, changes in board pad design, or the use of solder preforms. For more information on this workshop, visit www.zestron.com.
Herron has worked with the world renowned Dr. Ning-Cheng Lee in Indium Corporation's research and development laboratory for more than five years. In addition, his work with Indium Corporation’s Dr. Yan Liu focused on developments in solder paste and flux technologies. He has co-authored several research papers on the topic of QFN voiding. Herron has a bachelor’s degree in chemistry from Oklahoma State University, Stillwater, Oklahoma. He earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College and was certified in IPC-A-600 and IPC-A-610-D.
Indium Corporation 是全球電子、半導體、太陽能、薄膜及熱管理市場的首屈一指的材料製造商與供應商。 產品涵蓋焊料與助焊劑、釬料、熱界面材料、濺鍍靶材、銦、鎵、鍺及錫等金屬與無機化合物，以及 NanoFoil®。銦公司成立於 1934 年，擁有全球技術支援體系，並在中國、新加坡、南韓、英國及美國設有工廠。
如需進一步了解 Indium Corporation，請造訪indiumstg.wpenginepowered.com或發送電子郵件至[email protected]。
