Indium Corporations Dr. Ning-Cheng Lee, Vice President of Technology, will give a technology workshop at the SMTA South China Conference August 26 in Shenzhen, China.
Dr. Lees workshop, Electromigration The Hurdle for Miniaturization and High Power Devices, is a three-hour course that examines the electromigration phenomenon, including the effect of current density and temperature, the path through Al and Cu solder, the effect of solder grain orientation, the effect of solder composition and solder volume, and the resistance of solder joints. Upon completion of the workshop, attendees will receive certification from the SMTA. To register for this workshop, visit www.nepconsouthchina.com/en/smta_2013/.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, as well as encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on high performance and low cost of ownership.
The SMTA South China conference is held in conjunction with Nepcon South China. The conference covers the industrys most pressing issues in electronics assembly/manufacturing industry, including technology roadmaps, business focuses, advanced packaging, practical skill development, emerging technologies, and lead-free solder reliability.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더, 프리폼 및 플럭스, 브레이즈, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
