Indium Corporations Dr. Ning-Cheng Lee, Vice President of Technology, will give a technology workshop at the SMTA South China Conference August 26 in Shenzhen, China.
Dr. Lees workshop, Electromigration The Hurdle for Miniaturization and High Power Devices, is a three-hour course that examines the electromigration phenomenon, including the effect of current density and temperature, the path through Al and Cu solder, the effect of solder grain orientation, the effect of solder composition and solder volume, and the resistance of solder joints. Upon completion of the workshop, attendees will receive certification from the SMTA. To register for this workshop, visit www.nepconsouthchina.com/en/smta_2013/.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, as well as encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on high performance and low cost of ownership.
The SMTA South China conference is held in conjunction with Nepcon South China. The conference covers the industrys most pressing issues in electronics assembly/manufacturing industry, including technology roadmaps, business focuses, advanced packaging, practical skill development, emerging technologies, and lead-free solder reliability.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、太陽電池、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだ、プリフォーム、フラックス、ろう材、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウムの金属および無機化合物、NanoFoil®などがある。1934年に設立されたインジウムは、グローバルな技術サポートと中国、シンガポール、韓国、英国、米国に工場を有しています。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
