Indium Corporations Dr. Ning-Cheng Lee, Vice President of Technology, will give a technology workshop at the SMTA South China Conference August 26 in Shenzhen, China.
Dr. Lees workshop, Electromigration The Hurdle for Miniaturization and High Power Devices, is a three-hour course that examines the electromigration phenomenon, including the effect of current density and temperature, the path through Al and Cu solder, the effect of solder grain orientation, the effect of solder composition and solder volume, and the resistance of solder joints. Upon completion of the workshop, attendees will receive certification from the SMTA. To register for this workshop, visit www.nepconsouthchina.com/en/smta_2013/.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, as well as encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on high performance and low cost of ownership.
The SMTA South China conference is held in conjunction with Nepcon South China. The conference covers the industrys most pressing issues in electronics assembly/manufacturing industry, including technology roadmaps, business focuses, advanced packaging, practical skill development, emerging technologies, and lead-free solder reliability.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料、預成型品和助熔劑；銅钎；濺鍍靶材；铟、鎵和锗金屬和無機化合物；以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠位於中國、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
