Indium Corporation’s Graham Wilson, applications engineer, will present at IMAPS UK Heat of the Matter (HtM) Technical Conference, Oct. 23 at the University of Oxford, U.K.
Thermal interface materials (TIMs) play a critical role in transporting heat away from the power die within high-reliability, high-power applications, increasing functionality and the life of the power module. Wilson’s presentation, Thermal Interface Materials in High-Reliability Applications, will include the results of a performance comparison between Heat-Springs® and thermal grease, PCMs, and graphite. Criteria reviewed in this study included bake test, power cycling, changes in interface resistance and solder thickness, and thermal cycling.
Wilson supports European-based customers with comprehensive technical advice on the selection, use, and application of solder paste, flux, and engineered solders. His expertise spans a number of industries, including electronics assembly, optoelectronics, thermal management, semiconductor packaging, and more.
HtM is organized by IMAPS-UK and the University of Oxford, and sponsored by Indium Corporation. This event brings together developers, manufacturers, end-users and supply chain companies to promote business opportunities in the advanced high-temperature electronics sector. For more event information, visit uk.imapseurope.org.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인디엄 코퍼레이션에 대한 자세한 내용은 www.indium.com 또는 이메일 ([email protected])로 문의하세요.
