Indium Corporation’s Graham Wilson, applications engineer, will present at IMAPS UK Heat of the Matter (HtM) Technical Conference, Oct. 23 at the University of Oxford, U.K.
Thermal interface materials (TIMs) play a critical role in transporting heat away from the power die within high-reliability, high-power applications, increasing functionality and the life of the power module. Wilson’s presentation, Thermal Interface Materials in High-Reliability Applications, will include the results of a performance comparison between Heat-Springs® and thermal grease, PCMs, and graphite. Criteria reviewed in this study included bake test, power cycling, changes in interface resistance and solder thickness, and thermal cycling.
Wilson supports European-based customers with comprehensive technical advice on the selection, use, and application of solder paste, flux, and engineered solders. His expertise spans a number of industries, including electronics assembly, optoelectronics, thermal management, semiconductor packaging, and more.
HtM is organized by IMAPS-UK and the University of Oxford, and sponsored by Indium Corporation. This event brings together developers, manufacturers, end-users and supply chain companies to promote business opportunities in the advanced high-temperature electronics sector. For more event information, visit uk.imapseurope.org.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、太陽電池、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがあります。1934年に設立されたインジウムは、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を有しています。
For more information about Indium Corporation, visit www.indium.com or email [email protected].
