Indium Corporation’s Graham Wilson, applications engineer, will present at IMAPS UK Heat of the Matter (HtM) Technical Conference, Oct. 23 at the University of Oxford, U.K.
Thermal interface materials (TIMs) play a critical role in transporting heat away from the power die within high-reliability, high-power applications, increasing functionality and the life of the power module. Wilson’s presentation, Thermal Interface Materials in High-Reliability Applications, will include the results of a performance comparison between Heat-Springs® and thermal grease, PCMs, and graphite. Criteria reviewed in this study included bake test, power cycling, changes in interface resistance and solder thickness, and thermal cycling.
Wilson supports European-based customers with comprehensive technical advice on the selection, use, and application of solder paste, flux, and engineered solders. His expertise spans a number of industries, including electronics assembly, optoelectronics, thermal management, semiconductor packaging, and more.
HtM is organized by IMAPS-UK and the University of Oxford, and sponsored by Indium Corporation. This event brings together developers, manufacturers, end-users and supply chain companies to promote business opportunities in the advanced high-temperature electronics sector. For more event information, visit uk.imapseurope.org.
铟泰公司 面向全球电子、半导体、太阳能、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持体系，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
