Indium Corporation will proudly feature an array of innovative materials solutions for thermal management and advanced packaging applications at the IMAPS International Symposium on Microelectronics October 3-4, in San Diego, California.
As an industry leader in heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications, Indium Corporation will feature its proven SiPaste series, specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void, reduce slumping, and demonstrate consistent superior printing performance. The newly released, award-winning SiPaste C201HF offers the same superior printing performance with the benefit of having a cleanable chemistry with semi-aqueous-based solutions.
Indium Corporation will also feature NC-809, the first low-residue, no-clean, ball-attach flux on the market. NC-809 is a dual-purpose flux, engineered with high-tack characteristics for flip-chip applications and with superior wetting power for ball-attach applications. This material is designed to hold die or solder spheres in place without risk of die shift or solder sphere movement during the assembly process.
NC-809 is designed to leave minimal residue after reflow at the level of Indium Corporation’s proven ultra-low residue (ULR) flip-chip fluxes, such as NC-26S and NC-699. NC-809 is the first ULR flux qualified for ball grid array ball-attach applications for packages that are sensitive to traditional water cleaning processes. NC-809 also improves production yields by eliminating costly cleaning steps that can increase substrate warpage, both after reflow and before the underfilling steps, creating the potential for die damage and cracked solder joints.
Indium12.8HF is an award-winning, no-clean, halogen-free solder paste formulated to be compatible with a wide range of microdispensing and jetting systems. It provides exceptional deposition performance, and its unique oxidation barrier promotes complete powder coalescence during reflow to eliminate graping and similar reflow issues.
Also on display will be QuickSinter, a high metal content paste, redefining sinter technology. Available in pressure and pressureless formulations, this portfolio of sintering solutions delivers products engineered for customers’ specific application needs.
In addition to a diverse assembly of advanced packaging products, Indium Corporation will feature proven thermal management products at the show, as well. The company’s new line of innovative liquid metal pastes (LMP) has enabled a true liquid metal-based TIM solution capable of handling heat dissipation issues while maintaining long-term reliability. With higher viscosity than standard liquid metal, Indium Corporation’s next generation LMPs offer:
- Rth as low as 0.03kW
- Predictable spreading characteristics
- Lower risk of pump-out
- Lower total costs
Heat-Spring solutions, ideal for TIM2 applications, are a compressible interface between a heat source and a heat-sink. These indium-containing TIMs offer superior thermal conductivity over non-metalswith pure indium metal delivering 86W/mK. They are available as pure indium, pure indium clad with aluminum to prevent sticking to the device under test (DUT), indium-silver alloys, and indium-tin alloys.
The GalliTHERM portfolio of gallium-based liquid metal solutions draws on the company’s more than 60 years of experience in manufacturing gallium-based liquid metals. These liquid metal TIMs are designed for both TIM1 and TIM2 applications. Liquid metal TIMs offer:
- High thermal conductivity for end-product longevity and reliability
- Low interfacial resistance against most surfaces, ensuring rapid heat dissipation
- 금속 및 비금속 표면 모두에 대한 탁월한 습윤성
To learn more about Indium Corporation’s thermal management and advanced packaging solutions, visit our experts at booth #229. If unable to attend the show, visit us online at www.indium.com/TIM or www.indium.com/HIA for more information.
인디엄 코퍼레이션 소개
Indium Corporation 은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재 정제, 제련, 제조 및 공급업체입니다. 제품에는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil 이 포함됩니다. 1934년에 설립된 이 회사는 중국, 독일, 인도, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인디움 코퍼레이션에 대한 자세한 정보는 www.indium.com 또는 징야 황에게 이메일을 보내주세요. 또한 From One Engineer To Another (#FOETA)의 전문가를 www.linkedin.com/company/indium-corporation/ 또는 @IndiumCorp에서 팔로우할 수도 있습니다.
