Indium Corporation will proudly feature an array of innovative materials solutions for thermal management and advanced packaging applications at the IMAPS International Symposium on Microelectronics October 3-4, in San Diego, California.
As an industry leader in heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications, Indium Corporation will feature its proven SiPaste series, specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void, reduce slumping, and demonstrate consistent superior printing performance. The newly released, award-winning SiPaste C201HF offers the same superior printing performance with the benefit of having a cleanable chemistry with semi-aqueous-based solutions.
Indium Corporation will also feature NC-809, the first low-residue, no-clean, ball-attach flux on the market. NC-809 is a dual-purpose flux, engineered with high-tack characteristics for flip-chip applications and with superior wetting power for ball-attach applications. This material is designed to hold die or solder spheres in place without risk of die shift or solder sphere movement during the assembly process.
NC-809 is designed to leave minimal residue after reflow at the level of Indium Corporation’s proven ultra-low residue (ULR) flip-chip fluxes, such as NC-26S and NC-699. NC-809 is the first ULR flux qualified for ball grid array ball-attach applications for packages that are sensitive to traditional water cleaning processes. NC-809 also improves production yields by eliminating costly cleaning steps that can increase substrate warpage, both after reflow and before the underfilling steps, creating the potential for die damage and cracked solder joints.
Indium12.8HF is an award-winning, no-clean, halogen-free solder paste formulated to be compatible with a wide range of microdispensing and jetting systems. It provides exceptional deposition performance, and its unique oxidation barrier promotes complete powder coalescence during reflow to eliminate graping and similar reflow issues.
Also on display will be QuickSinter, a high metal content paste, redefining sinter technology. Available in pressure and pressureless formulations, this portfolio of sintering solutions delivers products engineered for customers’ specific application needs.
In addition to a diverse assembly of advanced packaging products, Indium Corporation will feature proven thermal management products at the show, as well. The company’s new line of innovative liquid metal pastes (LMP) has enabled a true liquid metal-based TIM solution capable of handling heat dissipation issues while maintaining long-term reliability. With higher viscosity than standard liquid metal, Indium Corporation’s next generation LMPs offer:
- Rth as low as 0.03kW
- Predictable spreading characteristics
- Lower risk of pump-out
- Lower total costs
Heat-Spring solutions, ideal for TIM2 applications, are a compressible interface between a heat source and a heat-sink. These indium-containing TIMs offer superior thermal conductivity over non-metalswith pure indium metal delivering 86W/mK. They are available as pure indium, pure indium clad with aluminum to prevent sticking to the device under test (DUT), indium-silver alloys, and indium-tin alloys.
The GalliTHERM portfolio of gallium-based liquid metal solutions draws on the company’s more than 60 years of experience in manufacturing gallium-based liquid metals. These liquid metal TIMs are designed for both TIM1 and TIM2 applications. Liquid metal TIMs offer:
- 高導熱性可延長終端產品的壽命與可靠性
- 對大多數表面的介面阻抗低，可確保快速散熱
- Extraordinary wetting ability to both metallic and non-metallic surfaces
To learn more about Indium Corporation’s thermal management and advanced packaging solutions, visit our experts at booth #229. If unable to attend the show, visit us online at indiumstg.wpenginepowered.com/TIM or indiumstg.wpenginepowered.com/HIA for more information.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.
