Indium Corporation will feature its ultra-low voiding Indium10.1HF Solder Paste—which helps customers Avoid the Void®—at the SMTA International Technical Conference, Sept. 17-21, in Rosemont, Ill.
Indium10.1HF is an air reflow, no-clean, halogen-free, Pb-free solder paste specifically formulated to achieve ultra-low voiding, especially in bottom termination component (BTC) assemblies.
The flux chemistry is specifically engineered to improve reliability with:
- High ECM performance under low standoff components
- Outstanding solder beading
- 매우 낮은 브리징, 슬럼프 및 납땜 볼링
- Resistance to head-in-pillow
- 다양한 일반 신선 및 노화 금속화 및 표면 마감에 탁월한 습윤성 제공
- 낮은 변동으로 높은 인쇄 전송 효율성
Indium10.1HF is compatible with lead-free alloys such as SnAgCu, SnAg, and other alloy systems favored by the electronics industry. This solder paste is halogen-free per IEC 61249-2-21, test method EN14582.
For more information about Indium Corporation's low-voiding solder pastes, visit www.indium.com/avoidthevoid or see Indium Corporation at booth 517.
인디엄 코퍼레이션에 대한 자세한 정보는 www.indium.com 또는 이메일 ([email protected])로 문의하세요 . 또한 From One Engineer To Another® (#FOETA)의 전문가를 www.facebook.com/indium 또는 @IndiumCorp에서 팔로우할 수도 있습니다.
