Indium Corporation‘s Evan Griffith, product specialist, will share his technical knowledge and insight on the evolution of solder paste for semiconductor applications at the International Microelectronics Assembly & Packaging Society (IMAPS) 18th International Conference and Exhibition on Device Packaging at 10:30 a.m. local time, Thursday, March 10 in Fountain Hills, Arizona, U.S.
Advanced packaging techniques continue to evolve within the semiconductor industry. Within advanced packaging, heterogeneous integration has become a solution for those wishing to integrate distinct and complex dies into smaller packages. Many application trends are emerging to meet the challenges of heterogeneous integration which are causing the assembly process to become more intricate, with these trends requiring soldering material technology, especially that of solder flux, to be up to date and cutting edge. In Solder Flux Evolution for Heterogeneous Integration, Griffithwill discuss the evolution of solder fluxes for heterogeneous integration, including novel advancements in fluxes forflip-chip assembly, BGA ball-attach assembly, and assemblies which have advanced to necessitate fluxless component attach.
Griffith is a product specialist for SEMI/SAAM fluxes and SiPaste materials. He is based at Indium Corporation’s global headquarters. He is responsible for researching and analyzing customer and market data and facilitating current and prospective customers’ needs. Additionally, he supports customer inquiries, internal product trainings, and works closely with Indium Corporation’s R&D team on new applications. Griffith earned his bachelor’s of engineering degree in materials science, graduating with honors, and his master’s of engineering management degree from the Thayer School of Engineering at Dartmouth College, Hanover, N.H., U.S. He has also earned his Six Sigma Green Belt.
인디엄 코퍼레이션 소개
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재 정제, 제련, 제조 및 공급업체입니다. 제품에는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil 이 포함됩니다. 1934년에 설립된 이 회사는 중국, 독일, 인도, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인듐 코퍼레이션(Indium Corporation)에 대한 자세한 정보는indiumstg.wpenginepowered.com을방문하거나Jingya Huang에게 이메일을 보내 주시기 바랍니다. 또한, ‘From One Engineer To Another’(#FOETA)라는 저희 전문가들의 채널을www.linkedin.com/company/indium-corporation/또는@IndiumCorp에서 팔로우하실 수 있습니다.
IMAPS 소개
The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through premier professional events, an exclusive microelectronics packaging research library, local chapter networks, and other efforts. Founded in 1967 as ISHM, then merging with the International Electronic and Packaging Society (IEPS) in 1996, the Society has over 50 years of networking, education, and publication history.
