Indium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.
At 10 a.m. local time, Indium Corporation Junior Application Engineer Siegfried Lorenz will present on a new solder paste technology for high-reliability applications. Based on novel solder paste alloy technology, this material offers special wetting behavior that supports low-voiding and enhanced thermal cycling performance (-40C/125C and -40C/150C). It also reduces solder joint cracking and increases shear strength.
“Perfectly suited for high-reliability applications, this new solder paste technology is the ideal choice for demanding applications that require longer thermal cycles,” said Lorenz. “The EPP InnovationsFORUM is an ideal platform to share this exciting data with my colleagues.”
Lorenz is responsible for providing application engineering support for Indium Corporation’s customers throughout Germany, Austria, and Switzerland. He provides customers with engineering and specifications assistance. He also helps to accelerate the sales cycle by providing technical recommendations. Prior to joining Indium Corporation, Lorenz held positions as a senior mechanic, SMD operator, and head of SMD with major semiconductor manufacturers and electronic design firms. He holds a bachelor’s degree in electrical technology and management.
인디엄 코퍼레이션 소개
Indium Corporation 은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재 정제, 제련, 제조 및 공급업체입니다. 제품에는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil 이 포함됩니다. 1934년에 설립된 이 회사는 중국, 독일, 인도, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인디엄 코퍼레이션에 대한 자세한 정보는 www.indium.com 또는 징야 황에게 이메일을 보내주세요. 또한 www.linkedin.com/company/indium-corporation/ 에서 전문가를 팔로우할 수 있습니다. (#FOETA).
