CLINTON, N.Y., April 30, 2026 — As a leading provider of advanced materials solutions enabling today’s demanding AI applications, Indium Corporation® experts will share their technical insight and knowledge on two industry-critical topics at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
Monday, May 4, 3:45 p.m. MYT
Advanced Materials Science Solutions for Next-Generation AI and Hyperscale Systems presented by Senior Area Technical Manager Kenneth Thum.
- This session presents materials innovations to meet rising AI and hyperscale computing challenges. This includes water-washable flux for fine-pitch micro-bumps, Durafuse® LT low-temperature solder to reduce package warpage, and metal thermal interface materials, including Heat-Spring® technology for extreme thermal management. These solutions create a pathway toward higher yields, greater thermal performance, and reliable operation in next-generation semiconductor systems.
Thursday, May 7, 2 p.m. MYT
Reflow and Reliability of InAg Soldering Thermal Interface Material With and Without Flux for TIM1 and TIM1.5 Applications presented by Assistant Product Manager Foo Siang Hooi.
- The presentation explores how indium-silver (InAg) solder thermal interface materials can effectively address escalating thermal demands in AI and high-performance computing. Fluxless InAg alloy performance is evaluated through multiple reflow cycles, measuring void formation and reliability under harsh conditions. The research provides critical insights for achieving superior thermal conductivity, low voiding, and enhanced reliability in next-generation CPU, GPU, and AI accelerator packages.
About the Presenters
Kenneth Thum is a senior area technical manager for Indium Corporation and is based in Penang, Malaysia. He assists customers in Southeast Asia by troubleshooting issues and providing technical support for Indium Corporation’s full product range. He has 16 years of experience in electronics assembly.
Foo Siang Hooi is an assistant product manager at Indium Corporation, where he plays a pivotal role in driving business development and expansion of engineered solder products across the Asia region. His responsibilities include delivering technical and commercial training on application technologies and products, and ensuring a comprehensive understanding for clients and stakeholders.
To learn more about Indium Corporation’s high-performance materials solutions, visit indium.com or meet with our experts at SEMICON SEA 2026, booth #2269.
인디엄 코퍼레이션 소개
인듐코퍼레이션®(Indium Corporation®)은 전 세계 전자, 반도체, 박막 및 열 관리 시장을 대상으로 하는 선도적인 소재 정제, 제련, 제조 및 공급 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열전도성 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, 그리고NanoFoil® 등이 있습니다. 1934년에 설립된 이 회사는 전 세계적인 기술 지원 체계를 갖추고 있으며, 중국, 독일, 인도, 말레이시아, 싱가포르, 한국, 영국 및 미국에 공장을 운영하고 있습니다. 인듐 코퍼레이션에 대한 자세한 정보는 indiumstg.wpenginepowered.com을 방문하거나 [email protected]으로 이메일을 보내주십시오. 또한 www.linkedin.com/company/indium-corporation/에서 당사의 전문가 그룹인 From One Engineer ToAnother® (#FOETA)를 팔로우하실 수 있습니다.
