CLINTON, N.Y., May 1, 2026 — As a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
Company products to be highlighted include the following:
- Formic Acid Soldering Technology (FAST) is an ideal reflow method for power device packaging. Product offerings, including preforms, InFORMS®, and novel solder pastes, enable high-reliability, flux-free soldering that is ideal for efficient manufacturing of next-generation power electronics.
- Heat-Spring® is a compressible, non-reflow metal thermal interface material (TIM) ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring® avoids pump-out and bake-out problems and offers a sustainable solution through the company’s metals and compounds reclaim and recycle program.
- Durafuse® LT is an award-winning solder paste alloy system with versatile characteristics that provide energy savings and high reliability in low-temperature step soldering. It is ideal for assemblies with broad temperature gradients and large BGAs with complex warpage profiles. Durafuse® LT delivers superior thermal cycling and drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and can outperform SAC305 with optimal process setup.
- InFORCE®29 is a range of pressure Cu sinter pastes for applications where high reliability and high thermal conductivity are critical. Applications for InFORCE®29 include die-attach for Si and SiC power devices and substrate-attach of power modules directly to coolers.
- SiPaste® series is specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void®, reduce slumping, and demonstrate consistent superior printing performance. These materials offer optimum transfer efficiency with consistent printing stability after continuous use and a long stencil life.
- NC-809 is a no-clean, ultra-low residue, ball-attach flux. Its dual-purpose engineering provides high-tack characteristics for flip-chip applications with strong wetting power for ball-attach applications.
To learn more about Indium Corporation’s high-performance materials solutions, visit indium.com or meet with our experts at SEMICON SEA 2006, booth #2269.
인디엄 코퍼레이션 소개
인듐코퍼레이션®(Indium Corporation®)은 글로벌 전자, 반도체, 박막 및 열 관리 시장을 대상으로 하는 선도적인 소재 정제, 제련, 제조 및 공급 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열전도성 인터페이스 재료, 스퍼터링 타겟, 인듐·갈륨·게르마늄·주석 금속 및 무기 화합물, 그리고NanoFoil® 등이 있습니다. 1934년에 설립된 이 회사는 전 세계적인 기술 지원 체계를 갖추고 있으며, 중국, 독일, 인도, 말레이시아, 싱가포르, 한국, 영국 및 미국에 공장을 운영하고 있습니다.
인듐 코퍼레이션(Indium Corporation)에 대한 자세한 정보는 indiumstg.wpenginepowered.com을 방문하거나 [email protected]으로 이메일을 보내 주시기 바랍니다. 또한 www.linkedin.com/company/indium-corporation/에서 당사의 전문가 그룹인 ‘From One Engineer ToAnother® (#FOETA)’를 팔로우하실 수 있습니다.
