Indium Corporation's Derrick Herron, technical support engineer, will present at the American Society of Mechanical Engineers (ASME) meeting on Oct. 28 at 6 p.m. at the Spaghetti Kettle in Clinton, N.Y.
Herron will discuss Indium Corporation's NanoFoil®, which is a unique product comprised of alternating nanoscale layers of aluminum and nickel. NanoFoil®'s distinct characteristics allow instantaneous material bonding at room temperature, even in the absence of air, making this a product with numerous applications in the electronics and assembly industries.
Herron provides technical service to customers in the northeastern United States. Previously, he spent more than six years working in Indium Corporation's research and development laboratory, focusing on developments in solder paste and flux technologies. Herron earned his bachelor's degree in chemistry from Oklahoma State University, Stillwater, Okla. He earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College and is certified in IPC-A-600 and IPC-A-610-D.
ASME is a not-for-profit organization that enables collaboration, knowledge sharing, career enrichment, and skills development across all engineering disciplines with a goal of helping the global engineering community develop solutions to benefit lives and livelihoods. Founded in 1880, ASME has more than 140,000 members in 151 countries.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인디엄 코퍼레이션에 대한 자세한 내용은 www.indium.com 또는 이메일 ([email protected])로 문의하세요.
