Indium Corporation's Derrick Herron, technical support engineer, will present at the American Society of Mechanical Engineers (ASME) meeting on Oct. 28 at 6 p.m. at the Spaghetti Kettle in Clinton, N.Y.
Herron will discuss Indium Corporation's NanoFoil®, which is a unique product comprised of alternating nanoscale layers of aluminum and nickel. NanoFoil®'s distinct characteristics allow instantaneous material bonding at room temperature, even in the absence of air, making this a product with numerous applications in the electronics and assembly industries.
Herron provides technical service to customers in the northeastern United States. Previously, he spent more than six years working in Indium Corporation's research and development laboratory, focusing on developments in solder paste and flux technologies. Herron earned his bachelor's degree in chemistry from Oklahoma State University, Stillwater, Okla. He earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College and is certified in IPC-A-600 and IPC-A-610-D.
ASME是一个非营利性组织，致力于促进所有工程学科之间的合作、知识共享、职业发展和技能培养，目标是帮助全球工程界开发解决方案，造福生活和生计。ASME 成立于 1880 年，在 151 个国家拥有 140,000 多名会员。
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
