Indium Corporation's Derrick Herron, technical support engineer, will present at the American Society of Mechanical Engineers (ASME) meeting on Oct. 28 at 6 p.m. at the Spaghetti Kettle in Clinton, N.Y.
Herron will discuss Indium Corporation's NanoFoil®, which is a unique product comprised of alternating nanoscale layers of aluminum and nickel. NanoFoil®'s distinct characteristics allow instantaneous material bonding at room temperature, even in the absence of air, making this a product with numerous applications in the electronics and assembly industries.
Herron provides technical service to customers in the northeastern United States. Previously, he spent more than six years working in Indium Corporation's research and development laboratory, focusing on developments in solder paste and flux technologies. Herron earned his bachelor's degree in chemistry from Oklahoma State University, Stillwater, Okla. He earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College and is certified in IPC-A-600 and IPC-A-610-D.
ASME是一个非营利性组织，致力于促进所有工程学科之间的合作、知识共享、职业发展和技能培养，目标是帮助全球工程界开发解决方案，造福生活和生计。ASME 成立于 1880 年，在 151 个国家拥有 140,000 多名会员。
铟泰公司 面向全球电子、半导体、太阳能、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持体系，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
