Indium Corporation's Sze Pei Lim, Technical Manager for Southeast Asia, will present at the Microelectronics Tech Asia Singapore Conference on Sept. 28-29 in Singapore.
Lim’s presentation, Challenges of Flip-Chip Die-Attach Using Flux, will include an overview of the different types of flip-chip fluxes, application and reflow process challenges, the cleaning process, and compatibility with capillary or molded underfill.
Microelectronics Tech Asia Singapore Conference is Singapore’s first technical conference and exhibition for the microelectronics design, manufacturing, materials, and equipment industry in Singapore. The event will cover topics relating to device design, IC packaging and assembly, electronics systems design, materials characterization and product prototyping.
Lim manages Indium Corporation’s technical teams throughout the Asia-Pacific region. She has a bachelor’s degree in chemistry from the National University of Singapore and 17 years of experience in the SMT and PCB assembly industries. Lim is an SMTA-certified process engineer and has a Six Sigma Green Belt. She joined Indium Corporation in 2007.
Indium Corporation은 전 세계 전자, 반도체, 박막, 열 관리 및 태양광 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
