Indium Corporation's Sze Pei Lim, Technical Manager for Southeast Asia, will present at the Microelectronics Tech Asia Singapore Conference on Sept. 28-29 in Singapore.
Lim’s presentation, Challenges of Flip-Chip Die-Attach Using Flux, will include an overview of the different types of flip-chip fluxes, application and reflow process challenges, the cleaning process, and compatibility with capillary or molded underfill.
Microelectronics Tech Asia Singapore Conference is Singapore’s first technical conference and exhibition for the microelectronics design, manufacturing, materials, and equipment industry in Singapore. The event will cover topics relating to device design, IC packaging and assembly, electronics systems design, materials characterization and product prototyping.
Lim manages Indium Corporation’s technical teams throughout the Asia-Pacific region. She has a bachelor’s degree in chemistry from the National University of Singapore and 17 years of experience in the SMT and PCB assembly industries. Lim is an SMTA-certified process engineer and has a Six Sigma Green Belt. She joined Indium Corporation in 2007.
Indium Corporation 是全球電子、半導體、薄膜、熱管理和太陽能市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
