Indium Corporation Product Manager of PCB Assembly Materials Tim Jensen will present Material and Process Optimization for Head-in-Pillow Elimination as part of SMTA's webinar series January 12, 2012, from 11 a.m. to 12:30 p.m. 

Tim's presentation will include an overview on Head-in-Pillow (HIP) defects and how process and material selection can have a significant impact on the potential for HIP defects. Tim will also analyze the printing and reflow processes for ways that optimization can help to significantly reduce the potential for HIP, including the critical solder paste attributes that can help minimize HIP.

As a product manager, Tim works with customers to troubleshoot and optimize SMT process lines. He specializes in Sn/Pb and Pb-free solder paste, halogen-free soldering materials, wave solder fluxes, bar solder, rework fluxes, and flux-cored wire.

Tim is an SMTA-certified process engineer and has earned his bachelor's degree in Chemical Engineering from Clarkson University. He readily shares his expertise by authoring technical papers, writing for technical publications, and participates actively in several IPC standards development committees. Tim also authors a blog, which can be found at

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Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

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