Two of Indium Corporation's technology experts will present their technical findings at IMAPS New England in Boxborough, MA, May 3, 2011.   Ronald C. Lasky, Ph.D., PE, Senior Technologist, will be presenting The Proliferation of Lead-Free Alloys and Reliability Status 2011. This paper provides an overview of lead-free alloy proliferation and an outlook on how alloy convergence might occur.   Seth Homer, Product Specialist, will be presenting Attributes of Different Power Amplifier Attach Methods. This presentation discusses how to select the appropriate joining materials for RF devices.   Dr. Lasky, holder of the prestigious SMTA Founder's Award, is a world-renown process expert and an Instructional Professor at Dartmouth College. He has over 25 years of experience in electronics and optoelectronic packaging and assembly. He has authored or edited five books and numerous technical papers and holds several patent disclosures. Dr. Lasky also authors a technology blog which can be found at   Seth Homer supports Indium Corporation's Engineered Solder Materials. He has been with the company for over 15 years, serving as manufacturing supervisor for various engineered electronics assembly materials, including solder spheres, sputtering targets, indium chemicals and solder preforms. Seth has also worked extensively with the customer support teams, especially those in China, Singapore and Europe.   Indium Corporation will be exhibiting at the event.   For more information about IMAPS and the technical conference, visit    Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA. For more information about Indium Corporation, visit or email